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SPI NOR Flash

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PY32 Series

VCM driver

Flash

EEPROM

MCU

Analog

L Series 1.65V~2.0V

H Series 2.3V～3.6V

U Series 1.65V～3.6V

N Series 1.1V～2.0V

WLCSP

L Series 1.65V～2.0V

H Series 2.3V～3.6V

L Series 1.65V～2.0V

SPI EEPROM

I²C EEPROM

WLCSP

CCM

SPI EEPROM

I²C EEPROM

Value

Main

Ultra low power

Touch Series

WLCSP

SPI NOR Flash

PY32F002B

PY32F031

PY32F032

PY32F040

PY32F071

PY32F072

PY32F403

PY32L020

PY32L090

PY32T020

PY32T090

PY32T092

H Series

L Series

U Series

Application

Mobile Phone PC and Peripherals Industry Automotive Electronics Consumer Electronics IOT

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86-21-61347010

HR Email:

talent@puyasemi.com

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MCU應(yīng)用測(cè)試工程師

1 people

上海

2024.01.11

Job responsibilities

1、根據(jù)MCU產(chǎn)品設(shè)計(jì)規(guī)格書制定驗(yàn)證方案及計(jì)劃，實(shí)施芯片驗(yàn)證、輸出測(cè)試報(bào)告

2、開(kāi)發(fā)MCU測(cè)試程序，測(cè)試平臺(tái)等軟硬件工作

3、開(kāi)發(fā)系統(tǒng)級(jí)測(cè)試平臺(tái)，完成板級(jí)功能測(cè)試，提高驗(yàn)證覆蓋率

4、針對(duì)測(cè)試結(jié)果進(jìn)行分析，確認(rèn)芯片的功能和性能與設(shè)計(jì)的符合度

5、編寫規(guī)格書，參考手冊(cè)，應(yīng)用手冊(cè)等技術(shù)文檔

6、協(xié)同研發(fā)、FAE等進(jìn)行新產(chǎn)品的debug

Submit

MCU應(yīng)用測(cè)試工程師

1 people

蘇州

2024.01.11

Job responsibilities

1、負(fù)責(zé)MCU芯片F(xiàn)PGA驗(yàn)證及新樣品（包含數(shù)字電路和模擬電路）的測(cè)試

2、依據(jù)芯片設(shè)計(jì)規(guī)格書，設(shè)計(jì)芯片驗(yàn)證平臺(tái)，制定驗(yàn)證方案，實(shí)施芯片驗(yàn)證、輸出測(cè)試報(bào)告

3、開(kāi)發(fā)芯片測(cè)試相關(guān)Firmware程序

4、針對(duì)驗(yàn)證結(jié)果進(jìn)行分析，確認(rèn)芯片的功能和性能與設(shè)計(jì)的符合度，編寫規(guī)格書，參考手冊(cè)，應(yīng)用手冊(cè)等文檔

5、協(xié)同研發(fā)、FAE等進(jìn)行新產(chǎn)品的debug

Submit

MCU資深測(cè)試工程師

1 people

上海

2024.01.11

Job responsibilities

1、負(fù)責(zé)MCU芯片F(xiàn)PGA驗(yàn)證及新樣品的測(cè)試

2、根據(jù)芯片規(guī)格，設(shè)計(jì)芯片驗(yàn)證平臺(tái)，制定驗(yàn)證方案，實(shí)施芯片驗(yàn)證、輸出測(cè)試報(bào)告

3、開(kāi)發(fā)芯片測(cè)試相關(guān)Firmware程序

4、針對(duì)驗(yàn)證結(jié)果進(jìn)行分析，確認(rèn)芯片的功能和性能與設(shè)計(jì)的符合度

5、協(xié)同研發(fā)、FAE等進(jìn)行新產(chǎn)品的debug

Submit

MCU應(yīng)用測(cè)試(高級(jí))經(jīng)理

1 people

上海

2024.01.11

Job responsibilities

1、負(fù)責(zé)整個(gè)MCU產(chǎn)品FPGA以及封裝片的測(cè)試驗(yàn)證工作

2、依據(jù)芯片設(shè)計(jì)規(guī)格書，制定驗(yàn)證方案，搭建芯片驗(yàn)證平臺(tái)，完成芯片驗(yàn)證并輸出測(cè)試報(bào)告

3、開(kāi)發(fā)芯片測(cè)試相關(guān)軟件硬件工作，提高測(cè)試效率

4、針對(duì)驗(yàn)證結(jié)果進(jìn)行分析，確認(rèn)芯片的功能和性能與設(shè)計(jì)的符合度

5、編寫MCU產(chǎn)品規(guī)格書，參考手冊(cè)，應(yīng)用手冊(cè)等相關(guān)配套技術(shù)文檔

6、協(xié)同研發(fā)、FAE等進(jìn)行新產(chǎn)品的debug

7、協(xié)同研發(fā)、支持TE進(jìn)行量產(chǎn)向量pattern開(kāi)發(fā)

8、公司安排的其他工作

Submit

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